梁豆豆

 

梁豆豆

教育经历

2015.09-2022.01北京科技大学材料科学与工程专业博士（硕博连读）

2018.09-2020.10日本北海道大学电子科学研究所博士联合培养

2011.09-2015.06济南大学材料科学与工程专业学士

工作经历

2022.02-至今鲁东大学集成电路学院讲师

研究领域

氧化物薄膜

氧化物薄膜晶体管

热电材料

发表文章

[1] Liang D*, Chen B, Feng B, Ikuhara Y, Cho HJ, Ohta H*. Optimization of two-dimensional channel thickness in nanometer-thick SnO₂-based top-gated thin-film transistors using electric field thermopower modulation: implications for flat-panel displays[J]. ACS Applied Nano Materials, 2020, 3(12) :12427-12432.

[2] Liang D*, Chen B, Cho HJ, Ohta H*. Thickness optimization toward high-performance bottom-gated transparent tin dioxide thin-film transistors[J]. ACS Applied Electronic Materials, 2020, 2(10): 3454-3458.

[3] Liang D*, Zhang Y, Cho HJ, Ohta H*. Electric field thermopower modulation analyses of the operation mechanism of transparent amorphous SnO₂thin-film transistor[J]. Applied Physics Letters, 2020, 116(14): 143503.

[4] Wei M#, Gong L#, Liang D#, Cho HJ, Ohta H. Fabrication and operating mechanism of deep‐UV transparent semiconducting SrSnO₃‐based thin film transistor[J]. Advanced Electronic Materials, 2020, 6(7): 2000100.（共同一作）

[5] Liang D, Zhang B*, Zou L. Enhanced thermoelectric properties of Cu_1.8S by Ti-doping induced secondary phase[J]. Journal of Alloys and Compounds, 2018, 731: 577-583.

[6] Liang D, Ge Z, Li H, Zhang B*, Li F. Enhanced thermoelectric property in superionic conductor Bi-doped Cu_1.8S[J]. Journal of Alloys and Compounds, 2017, 708: 169-174.

[7] Zhao Z, Liang D, Pei J, Shi JL, Wu Y, Zhang R, Zhang BP*. Enhanced thermoelectric properties of Mn_xCu_1.8S via tuning band structure and scattering multiscale phonons[J]. Journal of Materiomics, 2021, 7(3): 556- 562.

[8]赵英浩,张瑞,张波萍,尹阳,王明军,梁豆豆. Cu_(1.8-x)Sb_(x)S热电材料的相结构与电热输运性能[J].物理学报, 2021, 70(12): 9.

[9] Tang C, Liang D, Li H, Luo K, Zhang B. Preparation and thermoelectric properties of Cu_1.8S/CuSbS₂composites[J]. Journal of Advanced Ceramics, 2019, 8(2): 209-217.

[10] Zhang DB, Li HZ, Zhang BP, Liang D, Xia M. Hybrid-structured ZnO thermoelectric materials with high carrier mobility and reduced thermal conductivity[J]. RSC Advances, 2017, 7(18): 10855-10864.

[11] Pei J, Zhang BP, Li JF, Liang D. Maximizing thermoelectric performance of AgPb_mSbTe_m+2by optimizing spark plasma sintering temperature[J]. Journal of Alloys and Compounds, 2017, 728: 694-700.